產品資訊

MG32F10x SERIES

MG32F157VCT7

  • *Core: Arm® 32‐bit Cortex®‐M3 CPU
    • *96 MHz maximum frequency
    • *Single‐cycle multiplication and hardware division
  • *Memories
    • *256 K‐byte Flash memory, 0 wait state from 0 to 48 MHz and 1 wait states above.
    • *64 K‐byte SRAM, performance at 0 wait state memory access.
  • *Reset and supply management
    • *VDD:2V
    • *Power On Reset(POR),Power Down Reset(PDR), Programmable Voltage Detector(PVD)
  • *Clock
    • *External 4 ~ 24 MHz high speed clock(HSE)
    • *Internal 8 MHz high speed clock (HSI)
    • *External 32 KHz Low speed clock (LSE)
    • *Internal 40 KHz Low speed clock (LSI)
  • *Operation temperature
    • *‐40°C~+105°C
  • *Low power
    • *Sleep, Stop and Standby modes
    • *VBAT power supply mode (RTC and backup register)
  • *Up to 80 fast I/O ports
    • *All mappable on 16 external interrupt vectors,and most are compatible with 5V
  • *Debug mode
    • *SWD/Trace interface
  • *3 x 12‐bit, A/D converters , up to 18 channels(Contains built‐in temperature sensor and internal reference voltage two channels)
  • *2 x 12‐bit D/A converters
  • *Up to 15 communication interfaces
    • *Up to 2 I2C interface
    • *Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, maximum rate is 4.5Mbit/s , MODEM control,low power monitoring function and can wake MCU)
    • *3 SPI interfaces, 1 QSPI interface
    • *1 CAN, 1 USB, 1 SDIO
  • *Up to 11 timers
    • *4 general timers (32 bit)
    • *2 advanced timer (32‐bit)
    • *2 IWDG
    • *1 SysTick timer:
    • *2 basic timers(32‐bit)
  • *CRC calculation unit
  • *128‐bit unique ID
  • *Advanced Encryption Standard (AES)
  • *ESD (±5KV) HBM, Latch‐Up (±800mA)
  • *TRNG generate true Random number
  • *Built‐in ISP Bootloader , supports program upgrade through USART
  • *3 high speed rail to rail operational amplifiers

Document

DataSheet - Cortex-M3

Support

開發工具 - Cortex-M3

Sample Code - Cortex-M3

Application - Development Kit

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